Sputtering Targets for Physical Vapor Deposition (PVD)

Praxair Electronics is a global supplier of a wide range of high-performance deposition materials, including Ta, Cu, Al and Al alloys, Ti, W, Co, Ni alloys and precious metals. To support the industry’s transition to copper interconnects and tantalum barriers, Praxair Electronics introduced AdvanTage™ tantalum sputtering targets and Ultrafine Grain (UFG) copper targets. AdvanTage tantalum offers a consistent, reproducible process, with reliable target-to-target sputtering performance and consistently low Rs uniformity levels. UFG copper targets provide extremely uniform microstructure and controlled texture to improve total performance and increased target life.

Our 200mm and 300mm targets have been designed for mechanical stability, as well as to minimize or eliminate bow and deflection. Our portfolio of sputtering targets also includes the RE-Al™ and RE-Ti™ designs for improved cost of ownership in Al and Ti applications.

Sputtering targets are manufactured under the latest industrial safety, quality and environmental standards. The three regionally located facilities are in Orangeburg, New York; Toulouse, France; and Ch’onan, Korea. The New York facility operates under ISO 9001:2000 registration while Toulouse and Ch’onan facilities operate under ISO/TS 16949 registration. Additionally, Toulouse and Orangeburg have ISO 14001 registration for environmental standards.