Praxair Electronics offers a line of colloidal silica polishing
slurries used for chemical mechanical planarization (CMP) of
oxide layers in semiconductor wafers. Praxair has over 40 years
of abrasive and suspension development and manufacturing experience.
The CMP oxide slurries are available
in either potassium or ammonia-based forms. Both types have demonstrated
high removal rates combined with very low WIW (wafer-in-wafer)
and WTW (wafer-to-wafer) non-uniformities and minimal defectivity.
Our slurries are specifically formulated for oxide CMP planarization,
and produce a consistent polishing performance that is clean
and cost effective.
Our alliance with H.C. Starck GmbH to develop, manufacture and
supply colloidal silica slurries improves our ability to leverage
the expertise of
both companies to develop products with low cost
of ownership for global distribution.
In addition to polishing slurries, Praxair Electronics offers
high-performance CMP polishing belts and pads. Our 200mm and
300mm belts and pads have
been developed in conjunction with leading CMP
tool OEMs. Our belts have been used for over four years in high-volume
production at a leading semiconductor fab.
Praxair Electronics’ belt and pad products are
made using the same, patented process technology. Benefits include
superior performance, greater consistency, ease of use, and
reduced cost of ownership. Each belt and pad is individually
cast, finished, cleaned and packaged in our state-of-the-art
manufacturing facility in Salem, New Hampshire.